Sample of our Formal Letter for the Academia Week Event

Dynaprocom Group

Institute of Product Design and Manufacturing

University Kuala Lumpur

Jalan Shamelin Perkasa 9/8, Shamelin Perkasa

Kuala Lumpur

03-42563547

February 10, 2011

Head of section

Tooling Department

Possehl Electronic Sdn. Bhd

Lot. 112, Batu Berendam

162537, Melaka

Dear Sir/Madam

Tool And Die Equipment For Exhibition. 

We are organizing an exhibition for Academia Week at University Kuala Lumpur (IPROM) that will be held on 14-16 of March .In this exhibition, we would like to show some tools that are related to Tool and Die industry. 

This exhibition will give knowledge and exposure to students in tool and die manufacturing. Therefore, we would like to get your support in having two single Die and two progressive Die to be displayed in the exhibition. We believe this is an opportunity for your company to display some of your manufacturing technology for students learning purposes. We would be grateful if you let us to interview with some of your specialist in Tool and Die.

We will highly appreciate if you can support us and help to improve level of the exhibition. We would be interested in speaking with you to discuss this matter.

Sincerely yours,

Dynaprocom Group